Copper Ball Bonding An Evolving Process Technology
ball bonding using classic experimental designs Proc IEMT pp103 108 Sept 1986 and [2] M Sheaffer L Levine and B Schlain Optimizing the wire bonding process for copper ball bonding using classic experimental designs IEEE Transactions CHMT vol CHMT 10 No3 pp321 326 Sept 1987 [3] L Levine and M Sheaffer Copper Ball